MWC 2021 is begun, and Qualcomm has made the first important announcement. The Snapdragon 888 Plus chipset, developed by Qualcomm in San Diego, features a 3GHz main CPU core and a 20 percent enhanced AI Engine.
Qualcomm Snapdragon 888 Plus specs:
- CPU: Qualcomm Kryo 680, up to 3 GHz, 64-bit.
- GPU: Adreno-660.
- AI Engine: Hexagon 780, 32 TOPS.
- Modem: Snapdragon X60 5G Modem-RF, 7.5 Gbps DL, 3 Gbps UL, global 5G multi-SIM.
- Wi-Fi: FastConnect 6900, Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, Wi-Fi 802.11/a/b/g/n.
- Camera: Spectra 580 ISP, Triple camera up to 28 MP, Dual camera up to 64 MP, Single camera up to 200 MP. 720p @ 960 fps, 8K @ 30 fps.
- Display: 4K @ 60 Hz, QHD+ @ 144 Hz.
- Process technology: 5 nm.
- Other: Bluetooth 5.2, USB 3.1.
The chipset is nearly identical to its non-Plus sister, released in December, and features an ARM Cortex-X1 large core. The most significant difference is that the clock speed has been increased to 2.995 GHz – yeah, that’s the exact amount.
The Qualcomm Hexagon 780 AI processor has a 32TOPS (Tera Operations Per Second) capability, up from 26TOPS on the normal Snapdragon 888.
The rest of the specs haven’t changed much in the last six months: Adreno 660 GPU, Snapdragon X60 5G modem with 7.5 Gbps top DL speed, and FastConnect 6900, which supports all of the current Wi-Fi standards for rapid downloads when the user isn’t using mobile data.
Representatives from Asus, Motorola, Xiaomi, and vivo have stated that the new Snapdragon 888 Plus processor will be used in their forthcoming devices. Devices based on the new platform are planned to debut in Q3 2021.