The new Dimensity system-on-chip (SoC) from MediaTek is using advanced 3nm technology from TSMC. It will be available for commercial manufacturing starting next year. The strong partnership between MediaTek and TSMC has reached an important milestone. They have created powerful and energy-efficient chips that can be used in various devices. Both companies used their expertise in chip design and manufacturing to accomplish this.
Joe Chen, the President of MediaTek, said that they are dedicated to their goal of using highly advanced technology to make innovative products that enhance our lives in important ways. TSMC’s reliable and top-notch manufacturing abilities help MediaTek showcase its excellent designs in top-of-the-line chips. This allows us to provide the best performance and quality solutions to our customers worldwide, improving the user experience in the high-end market.
Dr. Cliff Hou, Senior VP of Europe and Asia Sales at TSMC, said that the collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC will make advanced semiconductor technology more accessible, just like the smartphone in your pocket. Over the years, we have worked closely with MediaTek to create many important new things for the market. We are happy to keep working together in the future, including on the next generation of technology called 3nm.
TSMC’s 3nm process technology can help make high-performance computing and mobile applications better by improving their performance and power efficiency. TSMC’s new 3nm technology makes devices faster by 18% without using more power. It also reduces power consumption by 32% without sacrificing speed. Additionally, it increases the amount of logic that can fit on a chip by about 60% compared to the previous N5 process.
MediaTek’s Dimensity SoCs use advanced technology to meet the growing demands of mobile computing, fast networking, AI, and multimedia. MediaTek will release a new powerful chip in the second half of 2024. This chip will be used in smartphones, tablets, cars, and other devices. It is made using a technology called TSMC’s 3nm process.