MediaTek’s Latest 6nm Dimensity 900 5G Chipset Brings Premium Features to High-End 5G Smartphones

The new Dimensity 900 5G chipset, the newest addition to MediaTek’s Dimensity 5G family, was announced today. The Dimensity 900 chipset, based on a 6nm high-performance manufacturing node, supports Wi-Fi 6, ultra-fast FHD+ 120Hz displays, and a 108MP primary camera for an incredible all-around experience.

“Dimensity 900 brings a suite of networking, display, and 4K HDR visual upgrades to high-tier 5G smartphones and provides brands with great design versatility for their 5G portfolios,” said Dr. JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit. “With super-fast and stable connectivity, the chipset’s support for 5G and Wi-Fi 6 ensures users get the most out of their devices.”

The Dimensity 900 chipset includes a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and bandwidth support up to 120MHz. The chipset consists of an octa-core central processing unit (CPU) with two Arm Cortex-A78 processors running up to 2.4GHz and six Arm Cortex-A55 cores 2GHz. Dimensity 900 supports flagship LPDDR5 memory and UFS 3.1 storage, as well as a 120Hz screen refresh rate, providing excellent performance enhancements and a seamless experience to 5G mobile devices.

The chipset also includes an Arm Mali-G68 MC4 graphics processing unit (GPU) and an independent artificial intelligence (AI) processing unit (APU) for maximum power efficiency and battery life. The third generation of MediaTek’s AI processing unit is highly power-efficient, allowing it to support a wide range of AI applications and 4K high definition resolution (HDR).

The Dimensity 900 incorporates many cutting-edge innovations, including:

  • MediaTek’s Imagiq 5.0: The chipset integrates a flagship-class, HDR-native image signal processor (ISP) and incorporates a unique hardware-accelerated 4K HDR video recording engine. This supports up to four concurrent cameras and up to 108MP sensors.
  • MediaTek’s MiraVision: The chipset packs upgraded video capabilities from a standard dynamic range (SDR) to HDR with real-time enhancements of HDR10+ video playback to improve color and contrast content.
  • Premium AI-Camera Enhancements: Smartphones powered by the Dimensity 900 will capture every detail with support for up to 108MP cameras with 32M at 30fps and multi-camera options 20+20MP. The chipset integrates our AI processing unit with ultra-efficient INT8, INT16, and accurate FP16 capabilities to deliver premium and super precise AI-camera results.
  • Advanced Connectivity: Dimensity 900 supports dual-SIM 5G standby function, 5G SA/NSA networking, and dual-SIM VoNR voice services. This chipset integrates a 2×2 MIMO Wi-Fi 6 connection, Bluetooth 5.2, and GNSS.
  • Smooth Gaming: Dimensity 900 supports MediaTek’s HyperEngine gaming engine. Advanced uninterrupted call technology supports gaming and dual-SIM calls at the same time, along with the 5G high-speed rail and super hotspot game modes.

The Dimensity 5G series from MediaTek offers smartphones an unrivaled mix of networking, multimedia, AI, and imaging technologies, powering premium and flagship devices with the Dimensity 1000, 1100, and 1200 families, as well as a variety of devices for the broader global market with the Dimensity 700, 800, and 900 families.

The Dimensity series embraces all connectivity generations, from 2G to 5G, as well as the most recent connectivity features, such as 5G standalone (SA) and non-standalone (NSA) architectures, 5G two carrier aggregation (2CC) across frequency division duplex (FDD), time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA), and Voice over New Radio (VoNR).

The new MediaTek Dimensity 900 processor will power devices scheduled to hit the global market in the second quarter of 2021.

Source: Mediatek

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